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| Title: | Thermally Coupled Thick-Film Thermistors: Main Properties and Applications | Authors: | Bodić, Milan |
Issue Date: | 2023 | Publication: | IEEE Sensors Journal | ISSN: | 1530-437X IEEE Sensors Journal Search Idenfier |
Publisher: | IEEE | Type: | Article | Collation: | vol. 23 br. 18 str. 21010-21017 | DOI: | 10.1109/JSEN.2023.3298224 | WoS-ID: | 001090399700054 | Scopus-ID: | 2-s2.0-85166310552 | URI: | https://enauka.gov.rs/handle/123456789/881281 | Metadata source: | (Preuzeto iz CrossRef-a) Damnjanović, Mirjana | Availability note: | Пуни текст није јавно доступан | M-category: | 21M21 |
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