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| Title: | Thermal Coupling of Ntc Chip Thermistors | Authors: | Bodic, Milan Z   ; Aleksic, Stanko O ; Rajs, Vladimir M ; Damnjanovic, Mirjana S ; Kisic, Milica G |
Issue Date: | 2024 | Publication: | 47th International Spring Seminar on Electronics Technology, ISSE, 15 - 19 May 2024, Prague | ISSN: | 2161-2536  Search Idenfier |
Publisher: | IEEE | Type: | Conference Paper | ISBN: | 979-8-3503-8547-2 Search Idenfier |
DOI: | 10.1109/ISSE61612.2024.10604210 | WoS-ID: | 001283808200085 | Scopus-ID: | 2-s2.0-85200438918 | URI: | https://enauka.gov.rs/handle/123456789/935220 | Project: | Ministry for Science, Education and Technological Development of the Republic of Serbia [451-03-68/2020-14/200132] | Metadata source: | (Preuzeto iz Nasi u WoS) | Availability note: | Пуни текст није јавно доступан | M-category: | Mp. category will be shown later |
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